Openair-Plasma® in Semiconductor Packaging
Plasma cleans and activates surfaces inline, quickly and in a controlled manner. In the semiconductor industry in particular, this enables highly particle-free process control, which reduces waste and increases quality. In addition to perfect adhesion and optimal wettability, service life and product stability also benefit: interface failures such as delamination (IDM) or internal cracking (CCM) can be significantly minimized through targeted plasma pretreatment.
Interface quality is crucial
Plasma cleans and activates surfaces inline, quickly and in a controlled manner. In the semiconductor industry in particular, this enables highly particle-free process control, which reduces waste and increases quality. In addition to perfect adhesion and optimal wettability, service life and product stability also benefit: interface failures such as delamination (IDM) or internal cracking (CCM) can be significantly minimized through targeted plasma pretreatment.
Modern semiconductor products consist of complex multi-material systems – from metal/metal to metal/polymer to various polymer combinations. Their reliability depends crucially on how cleanly and permanently the material interfaces are bonded. Even the smallest defects at these interfaces lead to delamination, cracks, or unexpected failures.
Four main factors jeopardize this critical interface quality:
- oxides that form in the wrong places
- poor wettability of surfaces
- contamination by particles and residues
- different coefficients of thermal expansion (CTE mismatch)
All these challenges can now be effectively addressed with plasma technology – without the use of harmful chemicals, cost-intensive vacuum technology, or expensive specialty gases.
Wafer Cleaning—Atmospheric-pressure Plasma, Maximum Purity
Advanced semiconductor devices begin with the purest wafer surfaces—because every subsequent process step depends on it. Silicon wafers, chips, and high-performance semiconductors are extraordinarily sensitive. Even the smallest contaminant can compromise performance and yield.
Traditionally, manufacturers relied on low-pressure plasma systems in sealed vacuum chambers for essential wafer cleaning. But the evolution der Openair-Plasma® technology has changed everything: Now, atmospheric-pressure plasma delivers nano-level surface cleaning inline—no vacuum required, no production bottlenecks.
Openair-Plasma® unleashes new possibilities for automation and efficiency.
By operating without a vacuum, process flows are dramatically simplified. Wafers move seamlessly from slicing and polishing directly into plasma treatment—every nano-structure is cleaned super-finely, with 100% removal of carbohydrates and particles. Error rates drop, and production speed increases.
This non-vacuum, inline plasma process enables:
- Maximum surface purity for all semiconductor materials
- Reliable, repeatable cleaning—no chemicals, no downtime
- Effortless integration in automated lines
- Reduced production cost and environmental impact
Result:
Every wafer enters the packaging workflow perfectly prepped—for wire bonding, die attach, or any next step—guaranteeing superior device reliability from the very beginning.
Die Attachment and Interconnection
A perfect connection is at the heart of every modern semiconductor packaging process. Contaminated, poorly prepared surfaces lead to bonding errors, delamination, “non-stick on pad” and premature failures. In processes such as wire bonding, die bonding (flip chip) and modern adhesive bonding, the quality of the surface determines reliability and performance.
Openair-Plasma® cleans and activates all critical surfaces—substrate, bond pads, chip/die. Oxide layers and disruptive residues are removed, and wettability and adhesion are optimally adjusted.
Lead Frame—Oxide Reduction
Oxide layers on metal lead frames can inhibit strong, reliable connections in semiconductor devices. Openair-Plasma® with the REDOX®-Tool removes these problematic layers—inline, dry, and without vacuum chambers—directly within your production flow.
Your benefits:
- Improved bond quality, electrically and mechanically
- Higher production yield with less waste
- Consistent, repeatable surface conditions and treatment results
Wire bonding—Maximum reliability through plasma activation
A perfect wire bond connection is the backbone of every modern IC – and it starts with an absolutely clean, activated surface. Even the slightest residues such as oxides or organic contaminants lead to “non-stick on pad,” weak shear strength, or even premature failure.
Only plasma activation creates the necessary conditions: contaminants are completely removed, and the bond pad surface is maximally activated. This not only ensures a stronger wire grip, but also reliable electrical and mechanical stability. Defects such as weak bonds, bond lift, or costly rework are dramatically reduced. The result: higher yield, stable and repeatable results – and a decisive quality advantage in every packaging workflow.
Openair-Plasma® is not an option – it is the key to reliable wire bonding.
Die Bonding—Why is plasma indispensable before the die attach process?
The quality of the die attach process directly determines the reliability and performance of every semiconductor device. Uneven bonding results, voids, or poorly adhering dies can impair overall functionality – from initial use to the end of service life.
With Openair Plasma®, every die and every substrate receives a perfect starting point: Organic residues and oxide layers are completely removed inline, and surfaces are precisely activated – without the need for vacuum or aggressive chemicals.
The effect is visible and measurable. Without plasma treatment, voids, delamination, and adhesion problems occur more frequently. With plasma, on the other hand, every die is bonded securely, firmly, and cleanly.
The result:
- Maximum process reliability and bond quality
- Clean removal of all contaminants
- Improved adhesion for adhesives, epoxy, and solder
- Perfect wettability – fewer voids, less delamination
- Reliable device performance even under thermal and mechanical stress
- Higher yield, less waste, consistent product quality
In short: With plasma, every die attach step becomes a technological masterpiece – for semiconductors that function and impress under all conditions.
Semiconductor Manufacturing - Video
- Dual lane concept
- Bar code scanning
- Control modules by PCU
- 100% yield and high-end product quality
Thermo-Compression Bonding (TCB)—Plasma ensures perfect flux-free connections
With Openair-Plasma® and REDOX® process, you create the perfect conditions for demanding bonding processes – for reliable advanced packages and high-end applications.
The result:
- Stable, void-free connections without the use of flux
- Maximum process reliability and repeatability
- Conducive to environmentally friendly and cost-efficient production
Maximum electrical and mechanical reliability
Plasma before fluxing
In Thermo-Compression Bonding (TCB), the quality of the surface determines the reliability and performance of the entire connection. Plasma treatment prior to fluxing creates a uniform, high-energy surface and ensures optimal wetting behavior. This significantly reduces the amount of flux required, making bonding more reliable and measurably increasing the reliability of the device.
Fluxless TCB
The removal of metal oxides is particularly important in flux-free TCB processes. Here, Plasmatreat's REDOX® technology offers automated, inline-capable plasma reduction: metal surfaces are completely cleaned and activated during the ongoing production process, and oxide layers are removed – without the use of chemicals or wet processes.
Consulting&
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Find out how to achieve up to 100% yield in the semiconductor industry with Openair-Plasma® by clicking on the Download Info Material button for the full story of practical solutions and impressive results.
Encapsulation Preparation
Stable, long-term reliable protective encapsulation is the backbone of modern semiconductor components. However, even the best encapsulation material can only achieve its full effect if the surfaces are optimally prepared. Invisible residues, oxides, or poor wettability quickly lead to delamination, air pockets, or defects—thus jeopardizing the electrical performance and long-term stability of the package.
Targeted plasma activation prior to encapsulation creates perfect surface conditions: The encapsulant can be distributed reliably and without bubbles, adheres to all relevant materials, and thus ensures long-lasting and comprehensive protection – even under the most demanding conditions.
Activation Before Underfill
High and uniform surface energy is the key prerequisite for underfill materials to wet reliably and flow seamlessly. With Openair Plasma®, substrate surfaces are activated directly in the inline process, ensuring that the underfill is optimally distributed and adheres reliably. At the same time, even the finest particles and residues from the dicing step are thoroughly removed. The result: perfect fillet formation, significantly fewer air pockets (voids), and encapsulation that provides maximum reliable protection in everyday use and under stress.
Surface Preparation for Molding and Encapsulation
The surface quality of the substrate is crucial for reliable molding and protective encapsulation. It is essential that all materials involved—from lead frames and fine wires to sophisticated encapsulants—are optimally cleaned, free of oxidation, and reactive. This is the only way to ensure a seamless material flow, maximum adhesion, and absolute long-term stability.
Openair Plasma® offers several specialized processes:
- Plasma cleaning removes all organic and inorganic residues that could impair adhesion or cause delamination.
- Plasma reduction removes even the finest metal oxides and creates highly active, chemically bondable surfaces.
- PlasmaPlus® Nano Coating (Conformal Coating) applies a thin, homogeneous barrier that protects against moisture and further increases material compatibility.
In combination, these processes ensure optimal flow of the potting material, prevent air pockets, and enable full compliance with REACH and MSL1 requirements—for maximum reliability even under the toughest production and operating conditions.
Nano coatings for optimum EMC adhesion
For particularly demanding packaging applications, nanoscale plasma coatings ensure optimum bonding between epoxy mold compounds (EMCs) and the prepared substrates or dies. The result: superior adhesion, maximum reliability, and consistent performance—even under the highest thermal and mechanical loads.
These nano-coatings create precisely tailored, highly active surfaces that effectively prevent delamination and cracking. This keeps the package stable and durable – from the first functional test to years of field use. Fewer defects, more output – and consistently high quality.
Barrier Coatings—Protection at the atomic level for sensitive ICs
Modern barrier coatings such as PlasmaPlus® make sensitive semiconductor components resistant to moisture, migration, and all forms of environmental influences. The atmospheric, extremely thin protective coating (typically 700–1,000 nm) effectively shields the internal components.
The advantages at a glance:
- Reliable protection against water and ionic contamination
- Ensures electrical insulation and long-term performance
- High resilience under thermal and mechanical stress conditions
This ensures that every IC package remains functional and electrically stable even under the harshest conditions.
Final Assembly Cleaning & Marking
The perfect finish to any semiconductor manufacturing process is crucial for delivery quality and functionality. Contamination from dust, handling, or residues often occurs during final assembly, which can compromise product safety and markability. At the same time, important markings such as barcodes, serial numbers, and laser engravings are applied here, which must adhere permanently and precisely.
This is where Openair Plasma® comes in: directly before packaging, marking, or ejection, inline plasma cleaning ensures absolutely flawless surfaces. This removes even the last particles, giving each component the “finishing touch” – flawless and ready for use. Innovative features such as barcode reader and dual lane integration, as well as intelligent PCU control, make the process flexible, scalable, and maximally reliable.
Your advantages:
- Particle- and residue-free end products right up to the delivery point
- Secure, permanent marking on any surface
- Highest yield rates thanks to minimized scrap
- Process reliability and quality assurance right up to the final production step
The finishing touch for perfection:
Only with clean, optimally prepared end products can you ensure genuine production reliability and delight your customers with every delivery – from start to finish.
