Maximum Performance Under Extreme Conditions
Power electronics are the backbone of modern energy converters, e-mobility, and industrial applications. Miniaturization and high performance require absolute reliability of every material connection – from the contact surface to the final encapsulation. Voids, oxides, and material mismatches become critical risk factors.
Power modules – the heart of modern power electronics
Power modules are the backbone of modern electronic power conversion – in e-mobility, industry, and renewable energies. They control extreme currents, require maximum miniaturization, and complex thermal management. Different materials such as SiC and MOSFET are becoming increasingly compact.
But it is precisely this progress that creates serious challenges:
- Voids and oxide layers as performance and service life killers
- Miniaturization and precision – every inaccuracy has an impact
- Thermal stress, complex material transitions, constant vibration
- Reputation and warranty risk due to failures, delamination, and complaints
Extreme demands on materials and connections
High-performance power modules must operate reliably for years under extreme conditions – whether in electric vehicles, wind turbines, or industrial drives. High temperatures, voltages, and mechanical stresses are combined with increasingly compact designs.
So-called “triple points” pose a particular challenge, where different materials such as copper, ceramics, and potting compounds come together. It is precisely in these zones that components are susceptible to stresses, air pockets, or adhesion problems – factors that can significantly shorten the service life of the module. One of the main reasons for this is that oxidized metal surfaces impair solderability and increase contact resistance. Overmolding also poses the risk of epoxy delamination.
Result:
These risks can only be permanently avoided through reliable interconnect technologies and targeted surface treatment.
Our solution for typical power pain points
- The REDOX® -Tool ensures the effective, inline removal of oxide layers on metal surfaces – especially on large lead frames and power modules.
- We treat the surface with Openair -Plasma® before sintering, soldering, or encapsulation steps to guarantee maximum adhesion and perfect connections.
- PlasmaPlus® provides a targeted nano-barrier coating that prevents moisture, ion migration, and premature aging.
- Continuous inline processing guarantees consistent process monitoring, the highest quality, and maximum output rates—even with very demanding designs.
Solution: Plasmatreat technologies in use
With Openair-Plasma® and the innovative REDOX®-Tool, you can prepare your surfaces optimally—for maximum adhesion, highest conductivity, and long-term reliability.
Special nano-coating protects against moisture, migration, and premature aging.
Customer benefits at a glance – With Plasmatreat, you are on the safe side
Maximum electrical conductivity, fewer errors and failures
The targeted removal of oxide layers with the REDOX®-Tool creates flawless metallic contact surfaces – particularly important for high-current modules and IGBTs. Additional plasma activation and nano-coating ensure secure, long-lasting connections during sintering and casting. This reduces delamination, maximizes conductivity, and ensures long-term reliability.
Reliable operation under extreme loads
Whether high temperatures in the sintering process or continuous mechanical stress in the field: Openair-Plasma® surface treatment prevents adhesion problems, minimizes voids and cracks, and ensures consistent performance – even in the most demanding automotive, industrial, and energy applications.
Lower warranty costs and longer service life
Defects such as voids and adhesion problems are minimized right from the production process. This increases the reliability of the modules, reduces complaints and rework, and extends service life – particularly relevant for industries with the highest quality standards.
Sustainable, environmentally friendly manufacturing
Plasmatreat deliberately relies on physical processes and avoids aggressive chemicals and fluxes. This saves resources, reduces the ecological footprint, and makes production safe and sustainable.
Maximum cost efficiency through automated inline processes
With Openair-Plasma® technology, surfaces can be treated automatically and continuously directly in the production flow—without downtime or manual reworking. This means consistently high quality, fast throughput times, and sustainably reduced unit costs. Less waste, higher yields, and minimal consumption of consumables lead to noticeable cost reductions.
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Inline oxide removal at the highest level
For the most demanding requirements in electrical contacts, bonding, and reliability in power modules, the REDOX®-Tool combines nitrogen and hydrogen in a tunnel process for the complete removal of oxide layers – fully automatically, inline, and without chemicals.
Learn more about the REDOX®-Tool
Industry-specific practical scenarios:
- E-mobility: Secure bonding, consistent performance even under continuous load
- Renewables: Perfect reliability despite UV, moisture, and temperature changes
- Industry/robotics: Strong bonds for dynamic applications
The solution: Precise surface treatment for reliable power modules
This is exactly where Plasmatreat's Openair-Plasma® technology and REDOX®-Tool come into play:
Effective inline cleaning and oxide reduction prepare surfaces so that all materials adhere perfectly and function reliably, even under extreme performance requirements. Voids, oxide layers, and weak adhesion are specifically eliminated.
The result:
- Improved electrical properties: Oxide-free, clean contacts ensure maximum conductivity—crucial for the operation of power modules and semiconductors in high-current applications.
- Higher yield, less rework: Clean processes lead to higher yield rates, less scrap, and consistently high product quality.
- Maximum reliability and service life: Permanent adhesion and the best possible material compatibility ensure trouble-free long-term use – even under the most difficult operating conditions.
With Plasmatreat, you can be sure of the best prospects for your next generation of high-performance power electronics.
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Discover how our Openair-Plasma® technology can enhance your processes in electronics production. Download the brochure or case study now!
